IL700/IL200高速数字信号隔离芯片
在速度和性能上都是顶级的...

IL700/IL200隔离芯片是工业标准的为固态信号进行隔离的器件，具有速度和性能双向顶级优势。IL700/IL200广泛应用在串口接口, 隔离CAN总线, 隔离SPI, 隔离A/D转换器和隔离电源接口。关键参数是：

  • +5 V/+3.3 V CMOS / TTL Compatible
  • Up to 150 Mbps (S-Series)
  • DC Correct
  • Up to 125°C (T-Series)
  • 2.5 kVrms Isolation (1 min.)
  • Low EMC Footprint
  • MSOP, SOIC, and PDIP Package
  • UL1577 & IEC 61010-2001 Approved
Part
(click for PDF data sheet)		 Data Rate
(Mbps)		 Transmit
Channels		 Receive 
Channels		 Maximum
Temperature		 Packages
IL710 110 (std.)
150 (IL710S)		 1 0 100°C (std.)
125°C (IL710T)		 MSOP-8, SOIC-8, PDIP-8
IL711 110 (std.)
150 (IL711S)		 2 0 100°C (std.)
125°C (IL711T)		 MSOP-8, SOIC-8, PDIP-8
IL712 110 (std.)
150 (IL712S)		 1 1 100°C (std.)
125°C (IL712T)		 MSOP-8, SOIC-8, PDIP-8
IL715 110 4 0 100°C (std.)
125°C (IL715T)		 0.15" SOIC-16,
0.3" SOIC-16
IL716 110 2 2 100°C (std.)
125°C (IL715T)		 0.15" SOIC-16,
0.3" SOIC-16
IL717 110 3 1 100°C (std.)
125°C (IL716T)		 0.15" SOIC-16,
0.3" SOIC-16
IL260 110 5 0 85°C 0.15" SOIC-16,
0.3" SOIC-16
IL261 110 4 1 85°C 0.15" SOIC-16,
0.3" SOIC-16
IL262 110 3 2 85°C 0.15" SOIC-16,
0.3" SOIC-16
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